About Polyberg, Our Competitiveness & Expertise
Advanced Silver Powder Engineering
Polyberg specializes in the engineering and supply of advanced silver-based powder materials, with a primary focus on silver-coated copper (Ag@Cu) powders and monodisperse spherical nano silver powders for high-performance electronics, photovoltaics, new energy, and other advanced functional applications. By precisely controlling composition, particle size, morphology, coating structure, and surface properties, Polyberg develops metal powders designed to meet the specific performance and processing requirements of downstream applications.
Silver-Coated Copper Powder
Polyberg’s Ag@Cu powders are engineered as cost-effective alternatives to pure silver, combining the conductivity advantages of silver with the material-efficiency benefits of a copper core. Both spherical and flake morphologies are available, with silver content, coating thickness, particle characteristics, and surface properties precisely tailored to application requirements.
Spherical Ag@Cu powders feature high sphericity, concentrated particle size distribution, smooth surfaces, and a continuous, dense, strongly adherent silver coating. Silver content can be precisely controlled from 5% to 25%, supporting applications such as low-temperature conductive pastes for HJT photovoltaic cells, high-end conductive circuit pastes, electromagnetic shielding pastes, and thermally conductive materials.
Flake Ag@Cu powders provide an extended conductive structure with a continuous and strongly bonded silver coating. Silver content can be flexibly adjusted from 5% to 30%, with flake thickness and surface properties tailored for downstream formulations. Key applications include conductive adhesives, low-temperature conductive pastes, electromagnetic shielding, radar-absorbing and stealth coatings, and thermally conductive materials.
Nano Silver Powder
Polyberg also specializes in monodisperse spherical nano silver powders in the 30–100 nm range, enabling precise control of particle size, specific surface area, dispersion, and sintering characteristics. These powders are designed for applications where fine particle size and controlled surface properties are critical to achieving high conductivity and enhanced processing performance.
The NP-30 series, with a nominal particle size of approximately 30 nm, is developed for low-temperature sintering pastes, low-silver-content high-conductivity pastes, and touchscreen applications. The NP-80 series, covering approximately 50–100 nm with an average particle size around 80 nm, is primarily used to enhance sintering activity and for medical antibacterial applications. Nano silver powders can also be supplied in suitable dispersion systems such as terpineol, IPA, or ethanol according to downstream processing requirements.
Additional Specialized Chemical Products
Polyberg also maintains capabilities in specialized chemical materials for pharmaceutical and biotechnology applications, including PEG linkers for antibody-drug conjugates (ADCs) and Fmoc- and Boc-protected unnatural amino acids for peptide and pharmaceutical synthesis.
With amino acid purity exceeding 99.5%, no single impurity above 0.1%, stable supply capabilities, and customized structures tailored to specific research needs, Polyberg supports applications ranging from ADC development and controlled drug release to peptide synthesis and pharmaceutical R&D. This complementary business extends Polyberg’s material expertise into specialized chemical building blocks.
Polyberg’s established product portfolio, with a primary focus on silver-coated copper (Ag@Cu) and nano silver powders, is covered by ChemWhat brand and trademark authorization, and also includes PEG linkers, Fmoc- and Boc-protected amino acids and peptides as complementary products for pharmaceutical and peptide-related applications.
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